TSIA 2024 半導體產業年會
Competitiveness, Challenge, Opportunity!

TSIA致力集結業界夥伴，共同應對半導體市場與技術之變化，開創整體競爭力。今年年會邀請BCG、微軟、台積電等先驅企業代表與陽明交通產學創新研究院院長一同參與，分享經驗與洞見。

2024年半導體產業年會主視覺以晶圓意象、鋪張出展翅的蝴蝶，打造無垠多元的科技感；同時象徵曾被稱為「蝴蝶王國」的台灣，以傑出的技術領先全球，於半導體產業再次飛翔，重回全球目光焦點！

TSIA is committed to gathering industry partners to jointly respond to changes in the semiconductor market and technology and create overall competitiveness. This year’s annual meeting invites representatives from pioneering companies such as BCG, Microsoft, and TSMC to participate together with the president of Yangming Communications Industry-Academic Innovation Institute to share experiences and insights.

The main visual of the 2024 Semiconductor Industry Association Convention uses the image of wafers and spreads out the wings of a butterfly to create an infinite and diverse sense of technology. It also symbolizes Taiwan, once known as the “Kingdom of Butterflies”, leading the world with outstanding technology and once again in the semiconductor industry. Fly and return to the global spotlight!

Client｜台灣半導體產業協會 TSIA
Ideation+Design & Printed Matter｜USEE Advertising